Reflow soldering is widely used to manufacture a wide range of electrical components. The tabletop reflow oven forms an integral part of the soldering process, and are also great for DIY component makers. The bench top design of it calls for minimal installation and simple operation for the home or commercial user.
Reflow soldering is commonly used to attach surface mounted components to a circuit board. Less commonly, reflowing can also be used to attach through-hole components to the circuit boards. Solder paste (solder mixed with flux) is used to temporarily attach electrical components to a contact pad. This newly assembled contact pad and attached electrical components are then subject to heating in order to melt the solder, creating a permanent joint. This second step is where the use of this machine comes in.
Reflow ovens must be used so that the areas other than the paste aren't burnt or heated to the point of damage. The four specific features of the oven successfully targets the paste. These consist of preheat, soak, reflow, and cooling stages.
The oven begins at the preheat zone, which is often the lengthiest of the stages. During this stage, the temperature increases at a rate of between 1 and 3 degrees Celsius per second. This temperature change is referred to as the ramp-up rate. The controlled ramp-up rate is essential in avoiding thermal shock or cracking of the components.
The second stage after preheating is calling the thermal soak zone, which is about one to two minutes. Thermal soaking briefly stabilizes the paste and stimulates the fluxes. If the temperature is too high, the components may splatter or oxidize, so the oven is used to regulate a narrow range of heat. The range must be narrow because too low a temperature won't stimulate the fluxes enough.
The third feature of the re-flow oven that offers peak temperatures is the reflow zone. Temperatures during this stage usually range between 20 to 40 degrees Celsius. Meanwhile, the specific temperature relies on the lowest heat tolerance of the component inside.
As a general rule, this temperature will be below 200 and 60 degrees Celsius, as this is the temperature at which damage may occur to the internal makeup of the components. The TAL is as important as selecting the correct temperature because only the correct time above reflow will allow the individual solder powders to combine and form the required bond. Incorrect TAL can result in either drying of the paste or create defective joints.
The re-flow oven finishes the entire molding process in its cooling stage. The melted paste between the components need to cool gradually to create a cohesive unit. If the component isn't cooled with proper measures, the unit might produce intermetallic accumulation or even go into thermal shock. Proper cooling actually requires a faster temperature change rate than heating for it to achieve the best durability. This faster cooling rate usually lies around 4 degrees Celsius per second.
Reflow soldering is commonly used to attach surface mounted components to a circuit board. Less commonly, reflowing can also be used to attach through-hole components to the circuit boards. Solder paste (solder mixed with flux) is used to temporarily attach electrical components to a contact pad. This newly assembled contact pad and attached electrical components are then subject to heating in order to melt the solder, creating a permanent joint. This second step is where the use of this machine comes in.
Reflow ovens must be used so that the areas other than the paste aren't burnt or heated to the point of damage. The four specific features of the oven successfully targets the paste. These consist of preheat, soak, reflow, and cooling stages.
The oven begins at the preheat zone, which is often the lengthiest of the stages. During this stage, the temperature increases at a rate of between 1 and 3 degrees Celsius per second. This temperature change is referred to as the ramp-up rate. The controlled ramp-up rate is essential in avoiding thermal shock or cracking of the components.
The second stage after preheating is calling the thermal soak zone, which is about one to two minutes. Thermal soaking briefly stabilizes the paste and stimulates the fluxes. If the temperature is too high, the components may splatter or oxidize, so the oven is used to regulate a narrow range of heat. The range must be narrow because too low a temperature won't stimulate the fluxes enough.
The third feature of the re-flow oven that offers peak temperatures is the reflow zone. Temperatures during this stage usually range between 20 to 40 degrees Celsius. Meanwhile, the specific temperature relies on the lowest heat tolerance of the component inside.
As a general rule, this temperature will be below 200 and 60 degrees Celsius, as this is the temperature at which damage may occur to the internal makeup of the components. The TAL is as important as selecting the correct temperature because only the correct time above reflow will allow the individual solder powders to combine and form the required bond. Incorrect TAL can result in either drying of the paste or create defective joints.
The re-flow oven finishes the entire molding process in its cooling stage. The melted paste between the components need to cool gradually to create a cohesive unit. If the component isn't cooled with proper measures, the unit might produce intermetallic accumulation or even go into thermal shock. Proper cooling actually requires a faster temperature change rate than heating for it to achieve the best durability. This faster cooling rate usually lies around 4 degrees Celsius per second.
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